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Flip Chip Bonder Series
Flip Chip Bonder Lineup Compatible with Various Bonding Methods
Outline
Compatible with various processes, including CoW, CoC, and CoS.
Customization is possible according to the requirements.
Applications
HPC, PLP, Server CPU, Application Processor, etc.
Applicable Process
CoW、CoC、CoS、Hybrid bonding、Fluxless bonding
Latest package with Toray technologies
Proposed Specifications
| Alignment Accuracy | 0.2μm〜 |
|---|---|
| Substrate (Wafer) Size | Wafer/ 0.3mm~PLP size |
| Chip Size | 0.3〜125mm |
| Applied Pressure | 0.1〜3000N |