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Bonder Series
Lineup of equipment compatible with various implementations
Lineup overview
- Compatible with various products such as chiplet, FPC, large die, and optical device.
- Compatible with various implementation methods such as TCB, DAF, and hybrid bonding.
- Supports wafer and large size panel (up to 600mm × 600mm).
- Various customizations available to meet specifications.
Lineup list
NEW High-accuracy PLP bonder UC5000
