Semiconductor Production Equipment
As the semiconductor industry rapidly moves towards miniaturization and high-precision, we offer unique and leading edge solutions represented by our flip chip bonders.
Lineup
Flip Chip Bonders
These are flip chip bonders used for the application of semiconductor packages.
We can meet a wide range of needs, from R&D to mass production.
Our lineup has a variety of bonders for TSV 3D mounting, FOWLP, optical devices, and other purposes.
Vacuum Printing Encapsulation System
We have unique printing systems that use vacuum technology.
These systems can be used in the manufacture of highly reliable devices in a variety of fields, as they are capable of void-less and low-stress coating.
Dedicated Wafer Titlers
These titlers are designed for the ID marking of wafers.They can offer clear markings within compact spaces.
Spot Reflow System
It is a device that solder heat-sensitive substrates / parts by local heating.
Laser Micro Trimming Equipment
This Equipment remove failure micro LED and failure Mini LED by laser abrations