TRENG-PLP Coater

Panel-Level Coating Equipment for Advanced Semiconductor Packaging

Overview

Equipment for advanced semiconductor packaging, utilizing our high-accuracy coating and large glass handling technologies established in the display industry.

Features

High-accuracy coating technology

• Timely development and high-quality coating enabled by in-house production of key devices.
• Proven top-tier performance in LCD applications requiring high color uniformity and precise film thickness control.
• Compatible with a wide range of materials from low to high viscosity.

Total process proposal from coating to drying

• Integrated line proposal covering cleaning, coating, drying, and curing.
• Process support using our demo line.

Warped substrate handling

• Proprietary warp correction mechanisms in each process unit for uniform film coating.
• Compatible with common warp shapes (Smile/Cry).

Applications

• Glass core substrates
• Glass carrier substrates
• 2.1D
• 2.3D
• 2.xD
• FOPLP (Fan-Out Panel Level Packaging)
• Organic interposers
• RDL (Redistribution Layer)
• PID (Passivation/Insulation Layer)
• Plating resist
• Carrier release layer

Specifications

Substrate Size	Up to 600 × 600 mm
Coating Materials	PID, PR, TBDB
Coating Method	Slit-die dispensing, Substrate stage moving
Viscosity Range	1 cP to 1,000 cP *
Options	Vacuum chamber dryer system, Hot plate/Cold plate, EFEM, Inline inspection units (visual, film thickness, substrate warpage, substrate stress inspections)

• Coating of materials with viscosity above 1,000 cP availabe as an optional. Please contact us for details.

Example of Semiconductor Packaging Application