2023-4-27

Simulating HV-SEM imaging of HARand buried features

• Event: SPIE Advanced Lithography, 2023, San Jose, California, United States
• Benjamin D. Bundaya, Shari Klotzkinb, Douglas Patriarchec, Yvette Balla, Maseeh Mukhtard, Kotoro Maruyam, Seul-Ki Kang, Yuichiro Yamazaki
  
  AMAG nanometro, Schenectady, NY, 12303, USA
  AMAG nanometro, Binghamton, NY, 13850, USA
  AMAG nanometro, Ottawa, ON, K2G 5M9, Canada
  KLA, Milpitas, CA, 95035, USA
  TASMIT/TORAY Inc., Yokohama-shi, Kanagawa-ken, Japan 222-0033

ABSTRACT

In this work, important use cases for HV-SEM will be explored by simulation, such as HAR hole / trench imaging with various profiles and depths, buried feature imaging to understand detection and effective resolution with depth for optical overlay cases, and buried defect and void detection, using a new improved electron beam simulator which greatly extends utility of JMONSEL, AMAG SimuSEM, enabling many complex simulation scenarios to be achievable with many improved outputs and other augmentations. The use of simulation designed experiments (DOEs) to predict best conditions and performance for the above applications will be demonstrated, along with some physical validation in the HV-SEM process space for the JMONSEL/SimuSEM physics kernel by reproducing a few cases in the literature and to experimental results on recent AMAG7 HAR measurement targets.

Key words: CD-SEM, HV-SEM, DI-SEM, JMONSEL, SimuSEM, HAR, contact, buried features, Monte Carlo simulation