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- Bonder Series
- UC5000 For PLP Bonder
UC5000For PLP Bonder
High-accuracy PLP bonder
Capable of supporting chiplet packaging with a 1 model.
Features
- Supports various bonding process including TCB, DAF, and Hybrid bonding.
- Accommodate 2 wafers or ~600x600mm panel
- Die can be supplied through various methods, wafers, trays, and tape & reel.
Multi capability
Spec
| Bonding accuracy（3σ） | 0.8 µm (for TCB) 0.2 µm (for Hybrid) |
|---|---|
| Bonding stage | 515 × 510 ｍｍ, 600 × 600 ｍｍ 300 ｍｍ wafer |
| Support die size | ～ 33 × 33 ｍｍ |
| Bonding force | 1 ～ 500 N |
| Bonding process | Face down, Face up |
PLP solution
| Cleaning & Inspection | Formulation TGV | Build-up Layer Coating | Drilling | RDL PR & PI Coating / Exposure | Pattern Inspection | Chip Bonding | |
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| cleaner & HS-Series | Laser & Etching | Coater & VCD | Laser Drill | Coater & VCD | Exposure Deve | INSPECTRA | Bonder |
