Inner Glass Marking Titlers "TGT series"

Marking the cord inside the glass substrate using a laser

It is a device that marks the ID code and alignment mark inside the glass by the inner glass marking (= IGM) method for production management · post-shipment management.


  • Markable inside of raw glass
  • Marking highly reliable code
  • Dust free process requires no cleaning
  • There is no influence of processes or chemicals, and the code does not change with time
  • Marking on thin glass substrate is also possible
  • Automatic quality check function after marking


Display field Glass, TFT · CF, OLED substrate etc
Semiconductor field PLP etc.
Other fields Thin film solar cells, Glass decoration etc.



Allowable substrate size 300mm×400mm~2,940mm×3,370mm
Glass substrate thickness 0.4 ~ 2.8mm
Takt time 40sec (In case of G8.5 4 ID)