PB3000
Post bonder for COS (COS: Chip On Substrate)
PB3000
Features
- Multi-head struture allows for various production quantities
- Equipment structure realize optimum profile for stacked packaging
- Perfectly suitable for NCF 2 Step-bounding process by combining pre-bonding equipment (FC3000series)
Option
2D Code reader, Ionizer, Bonding Inspection Unit, Upper Communication, etc.
Specifications for PB3000
| Chip size(mm) | 3 x 3 〜 14 x 14 mm |
|---|---|
| Substrate size(mm) | 125 x 30 〜 250 x 95 mm |
| Bonding force(N) | 9.8 〜 490 N |
| Head heater(℃) | R.T. 〜 450 ℃ |
| Stage heater(℃) | R.T. 〜 450 ℃ |
| Option | 2D-Code reader, Ionizer, monitoring PC, SECS/GEM |
| Number of heads | 3 〜 5 |
- Related terms
- Main Pressure
- Flip Chip Bonders
- COS
- 3D packaging
Inquiries
- CONTACT US
-
Tokyo office: +81-3-5962-9773
Shiga office: +81-77-544-1892
- Technological Field
- Technology >> Encapsulation, bonding, flip chip > Flip Chip Bonders