PB3000

Post bonder for COS (COS: Chip On Substrate)

PB3000

Features

  • Multi-head struture allows for various production quantities
  • Equipment structure realize optimum profile for stacked packaging
  • Perfectly suitable for NCF 2 Step-bounding process by combining pre-bonding equipment (FC3000series)

Option

2D Code reader, Ionizer, Bonding Inspection Unit, Upper Communication, etc.

Specifications for PB3000

Chip size(mm) 3 x 3 〜 14 x 14 mm
Substrate size(mm) 125 x 30 〜 250 x 95 mm
Bonding force(N) 9.8 〜 490 N
Head heater(℃) R.T. 〜 450 ℃
Stage heater(℃) R.T. 〜 450 ℃
Option 2D-Code reader, Ionizer, monitoring PC, SECS/GEM
Number of heads 3 〜 5

Inquiries

Technological Field
Technology >> Encapsulation, bonding, flip chip > Flip Chip Bonders
Industry Sector
Industry sector >> Semiconductors > Flip Chip Bonders