Wafer Inspection System "INSPECTRA®" Series
Wafer inspection system
Highest speed in the industry
INSPECTRA® Series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing.
INSPECTRA® Series are wafer inspection systems with high speed and high sensitivity.
Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
Providing a full lineup of products, such as SR series with an excellent reputation, SR-III series achieving faster inspection and inspection with higher magnification while keeping the operability of INSPECTRA, and FR-III series optimal for wafers following dicing, we meet various needs from customers.
Wafer Inspection System "INSPECTRA®" Series lineup
|SR-Ⅲseries||Feature||Work piece size|
|7000SR-Ⅲ200||Specialized design for "clean class 1" such as wafer front-end process (Etching, Litho, CMP, CVD and so on) required high clean class.
Contribution to process improvement with high performance of early detection of source of trouble by process monitoring with 100% inspection.
|3000SR-Ⅲ200||1.5x speed up than SR series, to prevent missing defects, supporting the 100% inspection with enough required sensitivity.Suitable for high sensitivity inspection of products such as LSI, CIS and MEMS same as 7000SR-Ⅲ.||2～8 inch|
|FR-Ⅲseries||Feature||Work piece size|
|3000FR-Ⅲ200||Optimal for inspection following dicing or expanding.Automatic tape frame feed.
(*1) Tape frame size: 300 mm
(*2) Tape frame size: 450 mm
|Convenient standard functions||Sensitivity simulation, PAD inspection, defect color image storage, bad mark recognition, chip rotation/misalignment correction (FR Series), etc.|
|Extensive range of options||Differential interference optical system, non-pattern inspection, automatic defect categorization, full image storage, result analysis function, wafer sorter, wafer cleaner, inker, support for various wafer transport methods, support for various communications methods, etc.|
|Usage track record||LSI, CISs, MEMS, LED, bump/TSV/Via inspection, power semiconductor, SiC, GaN, compound semiconductor|
- CONTACT US
Japan: Seta Office