Wafer Inspection System "INSPECTRA®" Series

Wafer inspection system "INSPECTRA® SR" Series

Wafer inspection system


Highest speed in the industry
INSPECTRA® Series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing.
INSPECTRA® Series are wafer inspection systems with high speed and high sensitivity.
Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.


Providing a full lineup of products, such as SR series with an excellent reputation, SR-III series achieving faster inspection and inspection with higher magnification while keeping the operability of INSPECTRA, and FR-III series optimal for wafers following dicing, we meet various needs from customers.


Defect detection example Differential interference optical system (DIC)
Inner crack detection example
FR-Ⅲ Series
FR-Ⅲ Series

Wafer Inspection System "INSPECTRA®" Series lineup

SR-Ⅲseries Feature Work piece size
7000SR-Ⅲ200 Specialized design for "clean class 1" such as wafer front-end process (Etching, Litho, CMP, CVD and so on) required high clean class.
Contribution to process improvement with high performance of early detection of source of trouble by process monitoring with 100% inspection.
2~8 inch
7000SR-Ⅲ300 8~12 inch
3000SR-Ⅲ200 1.5x speed up than SR series, to prevent missing defects, supporting the 100% inspection with enough required sensitivity.Suitable for high sensitivity inspection of products such as LSI, CIS and MEMS same as 7000SR-Ⅲ. 2~8 inch
3000SR-Ⅲ300 8~12 inch
FR-Ⅲseries Feature Work piece size
3000FR-Ⅲ200 Optimal for inspection following dicing or expanding.Automatic tape frame feed.
(*1) Tape frame size: 300 mm
(*2) Tape frame size: 450 mm
– 300mm(*1)
3000FR-Ⅲ300 – 450mm(*2)
Convenient standard functions Sensitivity simulation, PAD inspection, Defect color image storage, Non-pattern inspection, Cell to Cell inspection, Die to Die inspection、Automatic defect classification, full image storage, Active auto focus, Ionizer, Recipe sharing, Lighting calibration, Chip rotation/misalignmet correration (FR Series), etc.
Extensive range of options Differential interference optical system, Ring (Dark Field) illumination, Back side/Edge inspection, Result analysis system, Wafer cleaner, Measurement function, Color inspection, AI-ADC (Defect classification by AI), Support for various wafer transport methods (thin/warpage/substrate), Support for vatious communication medhods, etc.
Usage track record LSI, CISs, MEMS, LED, bump/TSV/Via inspection, power semiconductor, SiC, GaN, compound semiconductor