Review System "RV-3000"
Independent review functions for greater surface inspection productivity
Reduces surface inspection device review time and contributes to greater inspection efficiency.
This system uses address information for defects detected by surface inspection equipment to acquire images of defects with a high level of magnification, and categorizes defect types.
- High-speed acquisition of high-resolution images
- Defect categorization through connection with ADC system
- Contributes to greater analysis data acquisition efficiency and improved yield
- Supports post-dicing chip review
RV-3000 Clean class
RV-7000 Clean class1
This device reads in inspection results from surface inspection equipment and fully automatically acquires color images (defect images and reference images) at the specified magnification level.
|Objective Lens||1x, 2x, 5x, 10x, 20x, 50x, 100x, 150x Up to 5 can be selected|
|Work pieces||8, 12 inch wafer/8, 12 inch dicing ring|
|Lighting||Bright field /Dark field|
|Capture rate||Less than 1.2 sec / defect (including ADC Reference Picture saving time)|
|Features||Imaging conditions can be set as desired based on defect modes. Chip position data is acquired from the inspection equipment, enabling alignment-free high-speed imaging even of dicing chips.|
- CONTACT US
Japan: Seta Office