Overlay measurement system "OM-7000H"

OM-7000H

Measures wafer bonding misalignment and top-to-bottom alignment with a high degree of precision

Overview

Measures wafer bonding misalignment and top-to-bottom alignment to a high degree of precision.

Features

  • Support for completely automatic measurement
  • Supports both transmitted and reflected measurement
  • High-precision measurement using a unique measurement algorithm
  • High-precision focus using PZT stage
  • Automatic defect image storage
  • Can also measure top-to-bottom overlay patterns
  • Can be installed in a wafer bonding equipment

Specifications (OM-7000H)

Application examples: Stacked image sensors, stacked memory (Flash, D-RAM), next-generation IGBT, etc.

Measuring Method Edge detection by IR
Sample φ300mm
Stacked Wafers
Lighting Reflected IR / Transmitted IR
Objective lenses 5x: Global alignment
20x: Measurement
Repeatability 3σ≦10nm
Measurement Time 5sec/point
Clean class Class 1
Full Automation GEM300 compliant

Inquiries