News
- Dec. 4, 2024PressReleaseNEW
- Launch of TRENG-PLP Coater
~Panel Level Coater for Advanced Semiconductor Packaging~
- Dec. 3, 2024PressReleaseNEW
- Exhibit at “SEMICON Japan 2024”
- Nov. 5, 2024PressRelease
- Exhibit at “SEMICON Europa 2024”
- Oct. 30, 2024PressRelease
- Support for the “SORAURUSHI Project” Led by Kyoto City University of Arts
- Oct. 1, 2024PressRelease
- Exhibit at the International Battery Exhibition, “The Battery Show India – 2nd Edition”
- Sep. 20, 2024PressRelease
- Exhibit at the microLED exhibition, “MicroLED Connect 2024”
- Sep. 19, 2024PressRelease
- Exhibit at “Formnext”, the Next-Generation Intelligence Exhibition for 3D Printers
- Aug. 28, 2024PressRelease
- Exhibit at “SEMICON Taiwan 2024”
- Jul. 25, 2024News
- Toray Engineering Receives the Minister of Economy, Trade and Industry Award at the 37th Advanced Technology Award
- Apr. 17, 2024PressRelease
- Exhibit at the international display exhibition, “Touch Taiwan 2024”
- Apr. 16, 2024PressRelease
- Development of Packaging Technology for Ultra-Thin Semiconductor Chips
- Reduced Energy Consumption and Improved Production Efficiency -
- Apr. 10, 2024PressRelease
- Advantest & Toray Engineering Establish Technical Partnership
Joint Capabilities to Enhance MicroLED Display Manufacturing Efficiency
- Apr. 1, 2024News
- Notice of a Subsidiary’s Name Change
- Mar. 13, 2024PressRelease
- Exhibit at “SEMICON China 2024”
- Feb. 26, 2024PressRelease
- Exhibit at World’s Largest Composite Materials Exhibition, “JEC World 2024”
- Jan. 29, 2024PressRelease
- Exhibit at “SEMICON Korea 2024”
- Dec. 5, 2023PressRelease
- Commence Sales of INSPECTRA® SR-IV, Semiconductor Wafer Visual Inspection System with the Industry’s Fastest High-Magnification, High-Accuracy Inspection
- Nov. 13, 2023PressRelease
- Exhibit at “SEMICON Europa 2023”
- Sep. 19, 2023News
- Lecture at IMPACT 2023:Conference on Printed Circuit Boards and Packaging
- Sep. 8, 2023News
- Lecture at the 32nd 2023 JIEP Shuzenji Workshop
- Aug. 24, 2023News
- Lecture at the 10th Electronic Device Forum
- Aug. 21, 2023News
- Lecture at the MES2023 33rd Microelectronics Symposium
- Jun. 21, 2023PressRelease
- Enhancement of Core Shell Method CF Composite Material 3D Molding Machine
- May. 15, 2023PressRelease
- Opening Ceremony Held for Toray Engineering Europe GmbH
- Apr. 12, 2023PressRelease
- Exhibit at the international display exhibition, “Touch Taiwan 2023”
- Mar. 16, 2023PressRelease
- Additional Investment in LPIXEL Inc.
- Mar. 2, 2023PressRelease
- Development of an Eco-Friendly Coater for LiB Electrodes, Green Coater®
- Feb. 6, 2023News
- Lecture at the 37th JIEP Annual Meeting of the Japan Institute of Electronics Packaging
- Dec. 13, 2022PressRelease
- Commence Sales of INSPECTRA® CR-III, Semiconductor Chip Inspection System with the Industry's Highest Level of Accuracy
- Dec. 8, 2022PressRelease
- Introduction of Electricity Using Virtually 100% Renewable Energy at Headquarters and Second Headquarters
- Dec. 7, 2022PressRelease
- Establishment of New Subsidiary in Europe
- Dec. 1, 2022PressRelease
- Commence Sales of MT3000L High-Efficiency MicroLED Transfer System
- Nov. 10, 2022PressRelease
- Exhibit at “SEMICON EUROPA”
- Oct. 17, 2022News
- Lecture at FINETECH JAPAN 2022 Technical Conference
- Sep. 13, 2022PressRelease
- Exhibit at “SEMICON Taiwan 2022”
- Aug. 25, 2022PressRelease
- TRENG D Launches TONOPS® Logistics, a Logistics Management System Using AI Technology ~A One-Stop Solution to Improve Efficiency from Shipping to Delivery~
- Jul. 1, 2022News
- Notice of a Subsidiary’s Name Change
- Apr. 25, 2022PressRelease
- Exhibit at the international display exhibition,“Touch Taiwan 2022”
- Apr. 21, 2022PressRelease
- Toray Engineering and MAQsys sign joint project agreement Aiming to commercialize drug discovery research tools for ion channels
- Apr. 5, 2022News
- “CN Promotion Department”,a newly established organization to accelerate the efforts for carbon neutrality
- Mar. 31, 2022PressRelease
- Commencement of Sales of Resin Molding Simulation Software PD Advisor® 3.0
First in industry to come with function that proposes optimal design against deformation during molding
- Mar. 3, 2022PressRelease
- Introducing Electron Beam Semiconductor Wafer Pattern Verification System NGR®5500 with the Highest Level of Throughput and Accuracy in the World for Semiconductor Circuit Inspection
- Mar. 1, 2022News
- Notice Regarding Subsidiary Renaming
- Dec. 10, 2021PressRelease
- Commencement of Full-scale Sales of RAP-LLO Series of High-efficiency MicroLED Display Manufacturing Equipment Installed with AI Technology
- Nov. 17, 2021PressRelease
- Development of New Biometric Measurement System "μ-CAS" That Allows Easy and Highly Accurate Measurement of Muscle Fatigue
- Jul. 14, 2021PressRelease
- Introducing a High-performance Model that Combines AI with an Inspection Algorithm
in the INSPECTRA® Series of Semiconductor Wafer Inspection System
- Mar. 15, 2021News
- The Receipt of 2019 Supplier Achievement Award from Intel Corporation
- Feb. 8, 2021PressRelease
- Announcement of Taiwan Branch Integration
- Mar. 30, 2020PressRelease
- Reorganization of Solutions Businesses
- Jul. 31, 2019News
- Actions for EU RoHS on Toray Oxygen Analyzer
