News

Mar. 19, 2025

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Exhibit at “SEMICON China 2025”

Feb. 28, 2025

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Exhibit at World’s Largest Composite Materials Exhibition, “JEC World 2025”

Feb. 18, 2025

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Exhibit at “SEMICON Korea 2025”

Feb. 18, 2025

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Launch of a Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
— Industry’s First Double-Sided and Internal Defect Inspection —

Dec. 18, 2024

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Launch of the TOC-210 Series of Water Quality Analyzers
~Improved measurement functions and maintainability~

Dec. 4, 2024

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Launch of TRENG-PLP Coater ~Panel Level Coater for Advanced Semiconductor Packaging~

Dec. 3, 2024

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Exhibit at “SEMICON Japan 2024”

Nov. 5, 2024

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Exhibit at “SEMICON Europa 2024”

Oct. 30, 2024

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Support for the “SORAURUSHI Project” Led by Kyoto City University of Arts

Oct. 1, 2024

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Exhibit at the International Battery Exhibition, “The Battery Show India – 2nd Edition”

Sep. 20, 2024

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Exhibit at the microLED exhibition, “MicroLED Connect 2024”

Sep. 19, 2024

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Exhibit at “Formnext”, the Next-Generation Intelligence Exhibition for 3D Printers

Aug. 28, 2024

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Exhibit at “SEMICON Taiwan 2024”

Jul. 25, 2024

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Toray Engineering Receives the Minister of Economy, Trade and Industry Award at the 37th Advanced Technology Award

Apr. 17, 2024

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Exhibit at the international display exhibition, “Touch Taiwan 2024”

Apr. 16, 2024

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Development of Packaging Technology for Ultra-Thin Semiconductor Chips
- Reduced Energy Consumption and Improved Production Efficiency -

Apr. 10, 2024

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Advantest & Toray Engineering Establish Technical Partnership
Joint Capabilities to Enhance MicroLED Display Manufacturing Efficiency

Apr. 1, 2024

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Notice of a Subsidiary’s Name Change

Mar. 13, 2024

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Exhibit at “SEMICON China 2024”

Feb. 26, 2024

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Exhibit at World’s Largest Composite Materials Exhibition, “JEC World 2024”

Jan. 29, 2024

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Exhibit at “SEMICON Korea 2024”

Dec. 5, 2023

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Commence Sales of INSPECTRA® SR-IV, Semiconductor Wafer Visual Inspection System with the Industry’s Fastest High-Magnification, High-Accuracy Inspection

Nov. 13, 2023

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Exhibit at “SEMICON Europa 2023”

Sep. 19, 2023

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Lecture at IMPACT 2023:Conference on Printed Circuit Boards and Packaging

Sep. 8, 2023

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Lecture at the 32nd 2023 JIEP Shuzenji Workshop

Aug. 24, 2023

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Lecture at the 10th Electronic Device Forum

Aug. 21, 2023

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Lecture at the MES2023 33rd Microelectronics Symposium

Jun. 21, 2023

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Enhancement of Core Shell Method CF Composite Material 3D Molding Machine

May. 15, 2023

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Opening Ceremony Held for Toray Engineering Europe GmbH

Apr. 12, 2023

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Exhibit at the international display exhibition, “Touch Taiwan 2023”

Mar. 16, 2023

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Additional Investment in LPIXEL Inc.

Mar. 2, 2023

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Development of an Eco-Friendly Coater for LiB Electrodes, Green Coater®

Feb. 6, 2023

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Lecture at the 37th JIEP Annual Meeting of the Japan Institute of Electronics Packaging

Dec. 13, 2022

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Commence Sales of INSPECTRA® CR-III, Semiconductor Chip Inspection System with the Industry's Highest Level of Accuracy

Dec. 8, 2022

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Introduction of Electricity Using Virtually 100% Renewable Energy at Headquarters and Second Headquarters

Dec. 7, 2022

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Establishment of New Subsidiary in Europe

Dec. 1, 2022

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Commence Sales of MT3000L High-Efficiency MicroLED Transfer System

Nov. 10, 2022

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Exhibit at “SEMICON EUROPA”

Oct. 17, 2022

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Lecture at FINETECH JAPAN 2022 Technical Conference

Sep. 13, 2022

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Exhibit at “SEMICON Taiwan 2022”

Aug. 25, 2022

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TRENG D Launches TONOPS® Logistics, a Logistics Management System Using AI Technology ~A One-Stop Solution to Improve Efficiency from Shipping to Delivery~

Jul. 1, 2022

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Notice of a Subsidiary’s Name Change

Apr. 25, 2022

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Exhibit at the international display exhibition,“Touch Taiwan 2022”

Apr. 21, 2022

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Toray Engineering and MAQsys sign joint project agreement Aiming to commercialize drug discovery research tools for ion channels

Apr. 5, 2022

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“CN Promotion Department”,a newly established organization to accelerate the efforts for carbon neutrality

Mar. 31, 2022

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Commencement of Sales of Resin Molding Simulation Software PD Advisor® 3.0
First in industry to come with function that proposes optimal design against deformation during molding

Mar. 3, 2022

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Introducing Electron Beam Semiconductor Wafer Pattern Verification System NGR®5500 with the Highest Level of Throughput and Accuracy in the World for Semiconductor Circuit Inspection

Mar. 1, 2022

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Notice Regarding Subsidiary Renaming

Dec. 10, 2021

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Commencement of Full-scale Sales of RAP-LLO Series of High-efficiency MicroLED Display Manufacturing Equipment Installed with AI Technology

Nov. 17, 2021

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Development of New Biometric Measurement System "μ-CAS" That Allows Easy and Highly Accurate Measurement of Muscle Fatigue

Jul. 14, 2021

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Introducing a High-performance Model that Combines AI with an Inspection Algorithm
in the INSPECTRA® Series of Semiconductor Wafer Inspection System

Mar. 15, 2021

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The Receipt of 2019 Supplier Achievement Award from Intel Corporation

Feb. 8, 2021

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Announcement of Taiwan Branch Integration

Mar. 30, 2020

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Reorganization of Solutions Businesses

Jul. 31, 2019

News

Actions for EU RoHS on Toray Oxygen Analyzer