News

May. 13, 2025

PressRelease

Exhibit at “SEMICON SEA 2025”

Apr. 8, 2025

PressRelease

Gold Sponsor for ICEP-IAAC 2025, an International Conference on Semiconductor Packaging Technology

Apr. 3, 2025

PressRelease

TRENG D Launches TONOPS® Berth Reservation, a Truck Entry Reservation and Recording System with Industry-leading Cost Advantages

Mar. 26, 2025

PressRelease

Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels
~ High-accuracy packaging in panel level packaging ~

Mar. 19, 2025

PressRelease

Exhibit at “SEMICON China 2025”

Feb. 28, 2025

PressRelease

Exhibit at World’s Largest Composite Materials Exhibition, “JEC World 2025”

Feb. 18, 2025

PressRelease

Exhibit at “SEMICON Korea 2025”

Feb. 18, 2025

PressRelease

Launch of a Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
— Industry’s First Double-Sided and Internal Defect Inspection —

Dec. 18, 2024

PressRelease

Launch of the TOC-210 Series of Water Quality Analyzers
~Improved measurement functions and maintainability~

Dec. 4, 2024

PressRelease

Launch of TRENG-PLP Coater ~Panel Level Coater for Advanced Semiconductor Packaging~

Dec. 3, 2024

PressRelease

Exhibit at “SEMICON Japan 2024”

Nov. 5, 2024

PressRelease

Exhibit at “SEMICON Europa 2024”

Oct. 30, 2024

PressRelease

Support for the “SORAURUSHI Project” Led by Kyoto City University of Arts

Oct. 1, 2024

PressRelease

Exhibit at the International Battery Exhibition, “The Battery Show India – 2nd Edition”

Sep. 20, 2024

PressRelease

Exhibit at the microLED exhibition, “MicroLED Connect 2024”

Sep. 19, 2024

PressRelease

Exhibit at “Formnext”, the Next-Generation Intelligence Exhibition for 3D Printers

Aug. 28, 2024

PressRelease

Exhibit at “SEMICON Taiwan 2024”

Jul. 25, 2024

News

Toray Engineering Receives the Minister of Economy, Trade and Industry Award at the 37th Advanced Technology Award

Apr. 17, 2024

PressRelease

Exhibit at the international display exhibition, “Touch Taiwan 2024”

Apr. 16, 2024

PressRelease

Development of Packaging Technology for Ultra-Thin Semiconductor Chips
- Reduced Energy Consumption and Improved Production Efficiency -

Apr. 10, 2024

PressRelease

Advantest & Toray Engineering Establish Technical Partnership
Joint Capabilities to Enhance MicroLED Display Manufacturing Efficiency

Apr. 1, 2024

News

Notice of a Subsidiary’s Name Change

Mar. 13, 2024

PressRelease

Exhibit at “SEMICON China 2024”

Feb. 26, 2024

PressRelease

Exhibit at World’s Largest Composite Materials Exhibition, “JEC World 2024”

Jan. 29, 2024

PressRelease

Exhibit at “SEMICON Korea 2024”

Dec. 5, 2023

PressRelease

Commence Sales of INSPECTRA® SR-IV, Semiconductor Wafer Visual Inspection System with the Industry’s Fastest High-Magnification, High-Accuracy Inspection

Nov. 13, 2023

PressRelease

Exhibit at “SEMICON Europa 2023”

Sep. 19, 2023

News

Lecture at IMPACT 2023:Conference on Printed Circuit Boards and Packaging

Sep. 8, 2023

News

Lecture at the 32nd 2023 JIEP Shuzenji Workshop

Aug. 24, 2023

News

Lecture at the 10th Electronic Device Forum

Aug. 21, 2023

News

Lecture at the MES2023 33rd Microelectronics Symposium

Jun. 21, 2023

PressRelease

Enhancement of Core Shell Method CF Composite Material 3D Molding Machine

May. 15, 2023

PressRelease

Opening Ceremony Held for Toray Engineering Europe GmbH

Apr. 12, 2023

PressRelease

Exhibit at the international display exhibition, “Touch Taiwan 2023”

Mar. 16, 2023

PressRelease

Additional Investment in LPIXEL Inc.

Mar. 2, 2023

PressRelease

Development of an Eco-Friendly Coater for LiB Electrodes, Green Coater®

Feb. 6, 2023

News

Lecture at the 37th JIEP Annual Meeting of the Japan Institute of Electronics Packaging

Dec. 13, 2022

PressRelease

Commence Sales of INSPECTRA® CR-III, Semiconductor Chip Inspection System with the Industry's Highest Level of Accuracy

Dec. 8, 2022

PressRelease

Introduction of Electricity Using Virtually 100% Renewable Energy at Headquarters and Second Headquarters

Dec. 7, 2022

PressRelease

Establishment of New Subsidiary in Europe

Dec. 1, 2022

PressRelease

Commence Sales of MT3000L High-Efficiency MicroLED Transfer System

Nov. 10, 2022

PressRelease

Exhibit at “SEMICON EUROPA”

Oct. 17, 2022

News

Lecture at FINETECH JAPAN 2022 Technical Conference

Sep. 13, 2022

PressRelease

Exhibit at “SEMICON Taiwan 2022”

Aug. 25, 2022

PressRelease

TRENG D Launches TONOPS® Logistics, a Logistics Management System Using AI Technology ~A One-Stop Solution to Improve Efficiency from Shipping to Delivery~

Jul. 1, 2022

News

Notice of a Subsidiary’s Name Change

Apr. 25, 2022

PressRelease

Exhibit at the international display exhibition,“Touch Taiwan 2022”

Apr. 21, 2022

PressRelease

Toray Engineering and MAQsys sign joint project agreement Aiming to commercialize drug discovery research tools for ion channels

Apr. 5, 2022

News

“CN Promotion Department”,a newly established organization to accelerate the efforts for carbon neutrality

Mar. 31, 2022

PressRelease

Commencement of Sales of Resin Molding Simulation Software PD Advisor® 3.0
First in industry to come with function that proposes optimal design against deformation during molding

Mar. 3, 2022

PressRelease

Introducing Electron Beam Semiconductor Wafer Pattern Verification System NGR®5500 with the Highest Level of Throughput and Accuracy in the World for Semiconductor Circuit Inspection

Mar. 1, 2022

News

Notice Regarding Subsidiary Renaming

Dec. 10, 2021

PressRelease

Commencement of Full-scale Sales of RAP-LLO Series of High-efficiency MicroLED Display Manufacturing Equipment Installed with AI Technology

Nov. 17, 2021

PressRelease

Development of New Biometric Measurement System "μ-CAS" That Allows Easy and Highly Accurate Measurement of Muscle Fatigue

Jul. 14, 2021

PressRelease

Introducing a High-performance Model that Combines AI with an Inspection Algorithm
in the INSPECTRA® Series of Semiconductor Wafer Inspection System

Mar. 15, 2021

News

The Receipt of 2019 Supplier Achievement Award from Intel Corporation

Feb. 8, 2021

PressRelease

Announcement of Taiwan Branch Integration

Mar. 30, 2020

PressRelease

Reorganization of Solutions Businesses

Jul. 31, 2019

News

Actions for EU RoHS on Toray Oxygen Analyzer